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圖片1.png樣闆、小(xiǎo)批(pi)量、批(pi)量工(gong)藝製(zhi)程(cheng)能(néng)力(li)


序号
No.		項(xiang)  目(mu)
Item		樣闆能(néng)力(li)(小(xiǎo)于(yu)或等(deng)于(yu)2平米)
Sample order(less than 2m2)		小(xiǎo)批(pi)量能(néng)力(li) (小(xiǎo)于(yu)或等(deng)于(yu)20平米)
Middle lot qty(2m2 to 20 m2)		大(da)批(pi)量能(néng)力(li)(大(da)于(yu)20平米)
Big lot qty(more than 20m2)
1層數(shu)
Layer count		1-20 layer1-18 layer12 layer
2常用(yong)基材(cai)
Usual base material		FR4、高(gao)頻、鋁基、羅傑斯、高(gao)TG、銅基
FR4,High frequency board ,Al base boar,Rogers,High TG,Cu base board		FR4、高(gao)頻、鋁基、羅傑斯、高(gao)TG
FR4,High frequency board ,Al base boar,Rogers,High TG		FR4、高(gao)頻、鋁基、羅傑斯、高(gao)TG
FR4,High frequency board ,Al base boar,Rogers,High TG
3完成(cheng)闆厚
Final board thickness		0.30 mm - 4.00 mm
(6 mil - 196mil)		0.30 mm - 4.00 mm
(12 mil - 157 mil)		0.40 mm - 4.0mm
(16mil - 157mil)
4最小(xiǎo)芯闆厚度(不含銅)
Min core thickness（not including copper）		0.10mm(4 mil)0.10mm(4 mil)0.10mm(4 mil)
5完成(cheng)銅厚
Final copper thickness		Min.1/2 OZ, Max.6OZMin.1/2 OZ, Max.6OZMin.1/2 OZ, Max.4OZ
6最小(xiǎo)線(xiàn)寬咊(he)線(xiàn)距(補償前(qian))
Min trace width/space(Before compensation)

1、12um base Cu; 3.0/3.0mil

2、18um base Cu: 3.0/3.0mil

3、35um base Cu: 3/3mil      

4、53um base Cu:6/6mil      

5、70um base Cu：8/8mil  

6、105um base Cu：10/10mil

7、140um base Cu：12/12mil

1、12um base Cu; 3.0/3.0mil

2、18um base Cu: 3.0/3.0mil  

3、35um base Cu: 4/4mil    

4、53um base Cu: 6/6mil

5、70um base Cu：8/8mil

6、105um base Cu：10/10mil

7、140um base Cu：12/12mil

1、12um base Cu; 3.5/3.5mil

2、18um base Cu: 3.5/3.5mil

3、35um base Cu: 4/4mil

4、53um base Cu: 6/6mil

5、70um base Cu：8/8mil

6、105um base Cu：10/10mil

7、140um base Cu：12/12mil

7鑽孔最小(xiǎo)孔徑
Min hole size		0.20mm0.20 mm0.20 mm
8電(dian)鍍厚徑比
Aspect ratio		14:110:110:1
9Dimension Tolerance
(尺寸公(gōng)差(cha))		鑽孔孔位公(gōng)差(cha)
Tolerance of hole position		2mil3mil3 mil
鑽沉頭孔能(néng)力(li)
Ability of counter sunk hole		180°：最小(xiǎo)2.0mm，最大(da)不限(xian)製(zhi)
180°:Min 2.0mm,max no limit		180°：最小(xiǎo)2.0mm，最大(da)不限(xian)製(zhi)
180°:Min 2.0mm,max no limit		180°：最小(xiǎo)2.0mm，最大(da)不限(xian)製(zhi)
180°:Min 2.0mm,max no limit
90°：最小(xiǎo)2.0mm，最大(da)9.0mm
90°:Min 2.0mm,max 9.0mm		90°：最小(xiǎo)2.0mm，最大(da)9.0mm
90°:Min 2.0mm,max 9.0mm		90°：最小(xiǎo)2.0mm，最大(da)9.0mm
90°:Min 2.0mm,max 9.0mm
孔徑公(gōng)差(cha)
Hole tolerance		NPTH:±0.05mm（2mil）NPTH:±0.05 mm（2mil）NPTH:±0.05mm（2mil）
PTH:±0.075mm（3mil）PTH:±0.075 mm（3mil）PTH:±0.075 mm（3mil）
外形尺寸公(gōng)差(cha)
Tolerance of profile dimension		±0.10mm（4mil）±0.10mm（4mil）±0.10mm（4mil）
闆邊距最近導(dao)體(ti)的(de)間距
Distance between board edge line to Circuit		±0.20mm（8mil）±0.20mm（8mil）±0.20mm（8mil）
對稱結構翹曲度
The warping degree(balanced construction)		0.50%0.75%0.75%
10表面處理(li)
Surface finishing		有(yǒu)鉛噴錫、無鉛噴錫、全闆鍍金、沉金、沉錫、沉銀、OSP、鍍硬金、碳油
HAL、lead free HAL、Immersion gold、Immersion Tin、immersion sliver、OSP、Hard Gold、Carbon ink		有(yǒu)鉛噴錫、無鉛噴錫、全闆鍍金、沉金、沉錫、沉銀、OSP、鍍硬金、碳油
HAL、lead free HAL、Immersion gold、Immersion Tin、immersion sliver、OSP、Hard Gold、Carbon ink		有(yǒu)鉛噴錫、無鉛噴錫、全闆鍍金、沉金、沉錫、沉銀、OSP、鍍硬金、碳油
HAL、lead free HAL、Immersion gold、Immersion Tin、immersion sliver、OSP、Hard Gold、Carbon ink
11最大(da)生(sheng)成(cheng)品(pin)尺寸
Max finished size		普通(tong)闆：700mm * 600 mm  
Normal board：700mm * 600 mm		普通(tong)闆：700mm * 600 mm  
Normal board：700mm * 600 mm		普通(tong)闆：700mm * 600 mm  
Normal board：700mm * 600 mm
超長(zhang)闆：1300mm * 600 mm
Overlong board：1200mm * 600 mm		超長(zhang)闆：1300mm * 600 mm
Overlong board：1200mm * 600 mm		超長(zhang)闆：1300mm * 600 mm
Overlong board：1200mm * 600 mm
12V-CuttingV-CUT闆厚
Board thickness		0.40 mm-3.2mm0.40 mm-3.2mm0.40 mm-3.2mm
V-CUT餘厚
Min rest thickness		0.1mm0.2mm0.2mm
V-CUT尺寸公(gōng)差(cha)
V-CUT profile dimension tolerance		±0.10mm（4mil）±0.10mm（4mil）±0.10mm（4mil）
跳刀(dāo)最小(xiǎo)間距
Min space for V-cut tool jumping		12mm12mm12mm
V-CUT邊到(dao)圖形最小(xiǎo)距離
Min space bettween the edge of V-cut line to circuit		0.25mm0.25mm0.25mm
13槽孔
Slot		槽孔公(gōng)差(cha)
Slot dimension tolerance		PTH Slot:±0.075（3mil）PTH Slot:±0.075（3mil）PTH Slot:±0.075（3mil）
NPTH Slot:±0.05（2mil）NPTH Slot:±0.05（2mil）NPTH Slot:±0.05（2mil）
14金手指
Gold finger		倒角角度
Chamfer angle		20°、30°、45°20°、30°、45°20°、30°、45°
角度公(gōng)差(cha)
Tolerance of angle		±5°±5°±5°
深度公(gōng)差(cha)
Tolerance of depth		±0.2mm±0.2mm±0.2mm
15孔邊到(dao)孔邊的(de)最小(xiǎo)間距
Distance between holes(hole brim to hole brim)		相同網絡孔壁最小(xiǎo)間距（補償後(hou)）
The same nets(After compensation)		≥7mil≥8mil≥10mil
不同網絡孔壁最小(xiǎo)間距（補償後(hou)）
Different nets(After compensation)		≥12mil≥14mil≥16mil
16孔邊到(dao)線(xiàn)路圖形的(de)最小(xiǎo)間距
Min gap between hole to circuits(Hole brim to circuit brim)		PTH: 0.175mm（7mil）PTH: 0.175mm（7mil）PTH: 0.175mm（7mil）
NPTH: 0.15mm（6mil）NPTH: 0.15mm（6mil）NPTH: 0.15mm（6mil）
17幹膜封孔能(néng)力(li)(圓孔)
The cover hole ability of dry film(Round hole)		最大(da)封孔5.5mm
MAX: 5.5mm		最大(da)封孔5.0mm
MAX: 5.0mm		最大(da)封孔4.5mm
MAX: 4.5mm
封孔＞3.2mm(焊盤單(dan)邊10mil)
hole size＞3.2mm(annular ring 10mil)		封孔＞3.2mm(焊盤單(dan)邊12mil)
hole size＞3.2mm(annular ring 12mil)		封孔＞3.2mm(焊盤單(dan)邊12mil)
hole size＞3.2mm(annular ring 12mil)
3.2mm≥封孔＞1.2mm(焊盤單(dan)邊8mil)
3.2mm≥hole size＞1.2mm(annular ring 8mil)		3.2mm≥封孔＞1.2mm(焊盤單(dan)邊10mil)
3.2mm≥hole size＞1.2mm(annular ring 10mil)		3.2mm≥封孔＞1.2mm(焊盤單(dan)邊10mil)
3.2mm≥hole size＞1.2mm(annular ring 10mil)
封孔≤1.2mm(焊盤單(dan)邊6mil)
hole size≤1.2mm(annular ring 6mil)		封孔≤1.2mm(焊盤單(dan)邊6mil)
hole size≤1.2mm(annular ring 6mil)		封孔≤1.2mm(焊盤單(dan)邊8mil)
hole size≤1.2mm(annular ring 8mil)
18幹膜槽孔封孔能(néng)力(li)(焊盤單(dan)邊蓋(gai)膜≥14mil))
The cover hole ability of dry film for slot hole( the dry film cover the annular ring of the slot≥14mil)		闆厚0.4-0.6mm：寬2mm*長(zhang)7mm(max)
Board thickness 0.4-0.6mm：
width 2mm*length 7mm(max)		闆厚0.4-0.6mm：寬2mm*長(zhang)7mm(max)
Board thickness 0.4-0.6mm：
width 2mm*length 7mm(max)		闆厚0.4-0.6mm：寬2mm*長(zhang)7mm(max)
Board thickness 0.4-0.6mm：
width 2mm*length 7mm(max)
闆厚0.6-1.0mm:寬2.5mm*長(zhang)9mm(max)
Board thickness 0.6-1.0mm:width 2.5mm*length 9mm(max)		闆厚0.6-1.0mm:寬2.5mm*長(zhang)9mm(max)
Board thickness 0.6-1.0mm:width 2.5mm*length 9mm(max)		闆厚0.6-1.0mm:寬2.5mm*長(zhang)9mm(max)
Board thickness 0.6-1.0mm:width 2.5mm*length 9mm(max)
闆厚≥1.0mm:寬3.5mm*長(zhang)8mm(max)
Board thickness ≥1.0mm:width 3.5mm*length 8mm(max)		闆厚≥1.0mm:寬3.5mm*長(zhang)8mm(max)
Board thickness ≥1.0mm:width 3.5mm*length 8mm(max)		闆厚≥1.0mm:寬3.5mm*長(zhang)8mm(max)
Board thickness ≥1.0mm:width 3.5mm*length 8mm(max)
19內(nei)層對位公(gōng)差(cha)
Contraposition precision for inner layer		線(xiàn)路圖形層與層之(zhi)間公(gōng)差(cha)
Layer to layer		0.05mm（2mil）0.05mm（2mil）0.05mm（2mil）
線(xiàn)路圖形與二鑽孔的(de)公(gōng)差(cha)
Circuits to 2nd drilling		0.15mm（6mil）0.15mm（6mil）0.15mm（6mil）
20阻焊、字符製(zhi)程(cheng)
Solder mask and silk screen		最小(xiǎo)阻焊橋位寬
Min soldermask bridge		3mil（綠色），4mil其他(tā)顔色(基銅≤2OZ），綠色5mil,其他(tā)顔色7mil（基銅3-4OZ）
3mil（green），4mil for other color (base copper≤2OZ），green 5mil;7mil for other color (base copper3-4OZ）		3.5mil（綠色），4mil其他(tā)顔色(基銅≤2OZ），綠色6mil;其他(tā)顔色8mil（基銅3-4OZ）
3.5mil（green），4mil for other color (base copper≤2OZ），green 6mil;8mil for other color (base copper3-4OZ）		3.5mil（綠色），4mil其他(tā)顔色(基銅≤2OZ），綠色6mil;其他(tā)顔色8mil（基銅3-4OZ）
3.5mil（green），4mil for other color (base copper≤2OZ），green 6mil;8mil for other color (base copper3-4OZ）
最小(xiǎo)字符高(gao)度咊(he)寬度
Min legend height and width		高(gao)精(jīng)：高(gao)度20mil*寬度16mi
High precision:height 20mil and width 16mil
普通(tong)：高(gao)度26mil*寬度22mi
Normal:height 26mil and width 22mil		高(gao)精(jīng)：高(gao)度20mil*寬度16mi
High precision:height 20mil and width 16mil
普通(tong)：高(gao)度26mil*寬度22mi
Normal:height 26mil and width 22mil		高(gao)精(jīng)：高(gao)度20mil*寬度16mi
High precision:height 20mil and width 16mil
普通(tong)：高(gao)度26mil*寬度22mi
Normal:height 26mil and width 22mil
最小(xiǎo)字符線(xiàn)寬
Min legend line-width		3mil3mil3mil
阻焊最大(da)塞孔孔徑(成(cheng)品(pin)孔徑)
Solder mask plug hole (finished size)		0.7mm0.6mm0.6mm
阻焊開窗字符最小(xiǎo)寬度
The width of solder mask logo		基材(cai)位爲(wei)≥8mil
on the base material ≥8mil		基材(cai)位爲(wei)≥8mil
on the base material ≥8mil		基材(cai)位爲(wei)≥10mil
on the base material ≥10mil
大(da)銅面爲(wei)≥12mil
on the copper≥12mil		大(da)銅面爲(wei)≥12mil
on the copper≥12mil		大(da)銅面爲(wei)≥12mil
on the copper≥12mil
21Multilayers
多(duo)層		層間對準度
Contraposition precision with layer and layer		4 layers: 0.05mm(2mil)4 layers: 0.05mm(2mil)4 layers: 0.05mm(2mil)
6 layers: 0.075mm(3mil)6 layers: 0.075mm(3mil)6 layers: 0.075mm(3mil)
8 layers: 0.12mm(5mil)8 layers: 0.12mm(5mil)8 layers: 0.12mm(5mil)
10 layers: 0.12mm(8mil)10 layers: 0.12mm(8mil)10 layers: 0.12mm(8mil)
12 layers: 0.20mm(8mil)12 layers: 0.20mm(8mil)12 layers: 0.20mm(8mil)
14-18 layers: 0.20mm(8mil)14-18 layers: 0.20mm(8mil)14-18 layers: 0.20mm(8mil)
孔邊到(dao)內(nei)層圖形的(de)最小(xiǎo)距離
Min distance between hole brim and circuits in inner layer		≤6 layers：6mil≤6 layers：6mil≤6 layers：8mil
8 layers：7mil8 layers：8mil8 layers：10mil
10 layers：8mil10 layers：10mil10 layers：12mil
≥12 layers：10mil≥12 layers：12mil≥12 layers：12mil
最小(xiǎo)闆厚
Min board thickness		4 layers：0.40mm4 layers：0.40mm4 layers：0.40mm
6 layers：0.65mm6 layers：0.65mm6 layers：0.65mm
8 layers：1.0mm8 layers：1.0mm8 layers：1.0mm
10 layers：1.2mm10 layers：1.2mm10 layers：1.2mm
12 layers：1.4mm12 layers：1.4mm12 layers：1.4mm
14 layers：1.6mm14 layers：1.6mm14 layers：1.6mm
16 layers：1.85mm16 layers：1.85mm16 layers：1.85mm
18 layers：2.1mm18 layers：2.1mm18 layers：2.1mm
闆厚公(gōng)差(cha)
Board thickness tolerance		4layers：±0.10mm4layers：±0.10mm4 layers：±0.13mm
6layers：±0.13mm6layers：±0.13mm6 layers：±0.15mm
7-10 layers：±10%7-10 layers：±10%7-10 layers：±10%
11-18 layers：±10%11-18 layers：±10%11-18 layers：±10%
金手指間最小(xiǎo)間距（成(cheng)品(pin)）
Min gap between Gold finger（finishing board）		7mil7mil7mil
阻抗控製(zhi)
Impedance control		＜50Ω：±5Ω
≥50Ω：±10%		＜50Ω：±5Ω
≥50Ω：±10%		＜50Ω：±5Ω
≥50Ω：±10%
22表面處理(li)能(néng)力(li)
Surface finishing 		沉金金鎳厚度
The thickness of immersion gold		Au：0.025-0.1μm
Ni：3-5μm		Au：0.025-0.1μm
Ni：3-5μm		Au：0.025-0.1μm
Ni：3-5μm
沉銀銀厚
The thickness of immersion silver		0.1-0.3μm0.1-0.3μm0.1-0.3μm
OSP膜厚
The thickness of OSP		0.2-0.5μm0.2-0.5μm0.2-0.5μm
電(dian)金金鎳厚度
The thickness of platting gold		Au：0.15-1.3μm
Ni：3-5μm		Au：0.15-1.3μm
Ni：3-5μm		Au：0.15-1.3μm
Ni：3-5μm
噴錫錫厚
The thickness of HAL		1-40μm1-40μm1-40μm
碳油厚度
The thickness of Carbon ink		min: 10μmmin: 10μmmin: 10μm
沉錫錫厚
The thickness of Immersion Tin		0.8-1.2uμm0.8-1.2uμm0.8-1.2uμm
金手指金鎳厚度
The thickness of gold finger		Au：0.25-1.3μm
Ni：3-5μm		Au：0.25-1.3μm
Ni：3-5μm		Au：0.25-1.3μm
Ni：3-5μm
23盲/埋孔
Blind / Buried Vias		盲/埋孔最大(da)
Max hole size		0.8mm0.60mm0.60mm
盲/埋孔最小(xiǎo)
Min hole size		0.10mm0.15mm0.20mm
盲孔類型
Type of blind vias		二階盲孔
Second-order blind vias		二階盲孔
Second-order blind vias		二階盲孔
Second-order blind vias
24藍膠能(néng)力(li)
peelable mask		藍膠厚度
Thickness		0.2-0.6mm0.2-0.6mm0.2-0.6mm
藍膠蓋(gai)孔能(néng)力(li)
The cover hole ability of peelable mask		2.0mm (min)2.0mm (min)2.0mm (min)
藍膠與PAD最小(xiǎo)間距
Peelable mask brim to PAD brim		≥20mil≥20mil≥20mil
25VIP設(shè)計(ji)
VIP design		樹脂塞孔孔徑
The hole size of resin plug		min：0.15mm
max：0.4m		min：0.2mm
max：0.4m		min：0.2mm
max：0.4m
樹脂塞孔闆厚  
Board thickness		0.40-3.0mm
(16-118 mil)		0.40-3.0mm
(16-118 mil)		0.40-3.0mm
(16-118 mil)
塞孔厚徑比
Aspect ratio		10:18:18:1


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